The Influences of ACF with Bonding Processes on COF under Thermal Cyclic Loading

Owing to the fine pitch and the more pin counts on the higher density packaging processes, the anisotropic conductive film (ACF) is widely used for the electronic packages. The ACF is pressured to mount between the chip and the substrate so that the degree of deformation of the conductive particles can affect the performance of the package. In this study, the effects of the bonding pressures and temperatures on the chip on flex (COF) will be investigated in order to obtain the deformation of ACF. Moreover, the reliability assessment of ACF in the COF is a serious concern, such as the effect of the thermal cycles. Therefore, the behavior and reliability of components on the COF with the bonding procedures will be studied under the thermal cyclic loading in detail.