Mechanism and Fracturing Modes of Solder Joints Subjected to High-speed Shearing Forces

Author

Yeh, Chang-Lin ; Lai, Yi-Shao

Author_Institution

Adv. Semicond. Eng. Inc., Kaohsiung

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

1

Abstract

We develop a novel numerical simulation methodology by using LS-DYNA combining with erosion/interface fracturing elements and mass-scaled scheme in tins paper to research on transient structural responses of a single package-level solder joint subjected to high-speed (>100 mm/s) ball shear load. The proposed simulation procedure is benchmarked by comparing with experimental data obtained by using INSTRON Microimpact tester. After the numerical model is validated, transition conditions between IMC fracturing and bulk solder fracturing modes as well as relation between impact force and joint adhesion of interfaces are identified numerically therefore.

Keywords

shearing; solders; LS DYNA; erosion/interface fracturing elements; fracturing modes; high speed shearing forces; mass scaled scheme; mechanism modes; solder joints; transient structural responses; Benchmark testing; Bonding; Capacitive sensors; Numerical models; Numerical simulation; Semiconductor device packaging; Shearing; Soldering; Stress; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441506

Filename

4441506