The Effect of Aging on Microstructures Evolution and Shear Behaviors in Lead-free Solder Joint

Author

Yang, Minghui ; Qi, Fangjuan ; Ding, Yaping ; Ren, Deliang ; Xu, Changling

Author_Institution

Shijiazhuang Railway Inst., Shijiazhuang

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

4

Abstract

In this paper, the influence of aging treatment on microstructures evolution and shear strength in Sn-3.0Ag-0.5Cu, Sn-4.0Ag-0.5Cu and Sn-3.5Ag lead-free solders were investigated. For comparison, the specimens as-soldered and after aging at temperature of 100degC were respectively put up observation for IMC and shear test. Morphology, micro structure and component at interface of solder joint were observed and analyzed. The results show that morphology and microstructure of intermetallic compound change form long needle-like to scallop-like, and the thickness and quantity of intermetallic compound increases with increasing aging time. Shear load of the lead-free solder joint decreases at constant strain rate with increasing aging. At the identical work condition, the shear load of solder joint with different lead-free alloy had not significantly change. Sn-3.5Ag presents the better shear property than the others.

Keywords

ageing; copper alloys; shear strength; silver alloys; solders; surface diffusion; surface morphology; tin alloys; SnAg; SnAgCu; aging treatment; interface morphology; intermetallic compound; lead-free solder joint; microstructures evolution; shear behaviors; shear test; temperature 100 degC; Aging; Capacitive sensors; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Microstructure; Morphology; Soldering; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441512

Filename

4441512