Title :
Evaluation of the Thermal Resistance of CSOP24 Ceramic Package
Author :
Peng, Xiao ; Wang, Shuidi ; Jia, Songliang ; Cai, Jian ; Huang, Qiang ; Ding, Rongzhen
Author_Institution :
Tsinghua Univ., Beijing
Abstract :
On the basis of MIL STD 883 method 1012 and SEMI standard G30-88 and G32-86. purely electrical approaches were implemented to measure the thermal resistance of CSOP24 package. Firstly the temperature sensitive parameter (TSP) was measured and calibrated in a temperature controlled fluid trough. Then proper test conditions including measurement current (IM) and test power PHmiddot were chosen according to experiments. Thermal resistance measurements were carried out in the two conditions: radiator with big heat sink which keeps the case temperature Tc at 60 degC. and temperature controlled fluid trough. In addition, two kinds of thermal test chips with different size (1.91times1.91mm and 3.92times3.92mm) were used to test the influence of the chip size. Experimental result was provided. Moreover, the thermal resistance of the CSOP24 package was simulated by utilizing Fluent software.
Keywords :
ceramic packaging; heat sinks; thermal resistance measurement; CSOP24 ceramic package; Fluent software; electrical approaches; heat sink; temperature sensitive parameter; thermal resistance measurements; Ceramics; Electric resistance; Electric variables measurement; Electrical resistance measurement; Measurement standards; Packaging; Temperature control; Temperature sensors; Testing; Thermal resistance;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441523
