Title :
TEM Study of Bi Segregation in the Interconnect of Eutectic Tin-Bismuth Solder and Copper
Author :
Shang, P.J. ; Liu, Z.Q. ; Zhang, L. ; Li, D.X. ; Shang, J.K.
Author_Institution :
Chinese Acad. of Sci., Shenyang
Abstract :
The interfacial reaction between eutectic SnBi and Cu was studied by TEM after the sample was reflowed and aged in solid state, respectively. The microstructural evolution at the SnBi/Cu interface during reflowed and solid-state aged process was analyzed. The results show that there are two layers of intermetallic compounds (IMCs), Cu3Sn and Cu6Sn5, located at the interface between solder and Cu after the sample was reflowed. The segregation of Bi at the interface between Cu3Sn and Cu was observed. Furthermore, the segregation of Bi induced the formation of voids at Cu3Sn/Cu interface during solid-state aging process.
Keywords :
ageing; bismuth alloys; copper; eutectic alloys; interconnections; reflow soldering; surface segregation; tin alloys; transmission electron microscopy; voids (solid); Cu3Sn; Cu6Sn5; SnBi-Cu; TEM study; bismuth segregation; copper; electronic interconnection; eutectic tin-bismuth solder; interfacial reaction; intermetallic compounds; microstructural evolution; reflowing process; solid-state aging process; void formation; Aging; Bismuth; Copper; Environmentally friendly manufacturing techniques; Integrated circuit interconnections; Intermetallic; Lead; Materials science and technology; Soldering; Solid state circuits;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441534
