Image Inspecting System of Positioning Accuracy of the Die Bonder

Author

Huang, Xiangxiu ; Li, Ketian ; Liu, Ji´an ; Liu, Jian-qi ; Weng, Ji-zhao

Author_Institution

Guangdong Univ. of Technol., Guangzhou

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

4

Abstract

This article realizes online inspection of the positioning accuracy of the high speed die bonder by using Lab VIEW, IMAQ Vision and Motion, combined with the PCI-1409 images acquiring and PCI-7330 motion control hardware devices and image processing algorithm such as image calibration, image enhance, and pattern matching.

Keywords

calibration; computer vision; electron device manufacture; electronic engineering computing; image enhancement; image matching; inspection; microassembling; motion control; production engineering computing; IMAQ Vision and Motion; Lab VIEW; PCI-1409 images; PCI-7330 motion control hardware devices; die bonder; image calibration; image enhancement; image inspecting system; image processing algorithm; online inspection; pattern matching; positioning accuracy; Bonding; Calibration; Charge coupled devices; Control systems; Image edge detection; Image processing; Inspection; Motion control; Pattern matching; Pixel;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441540

Filename

4441540