SiP - A Catalyst for Innovation

Author

Chen, William

Author_Institution

President of IEEE-CPMT, USA

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

1

Abstract

This talk will review the electronic market landscape. Today consumers have become a major factor in driving innovations in the electronics industry towards expanding envelops of requirements in lower cost, smaller form factor. and increased functionality. System in package (SiP) and system on chip (SoC) are two powerful technology directions for the industry to rise to the challenges posed by the consumer-driven market place. The fundamental concept of SiP has been a catalyst to free the engineering community to drive packaging structure in the 3rd dimensions and to integrate beyond traditional digital IC technologies, to MEMS. RF & mixed signal. optoelectronics and bio chips.

Keywords

catalysts; system-in-package; system-on-chip; SiP; catalyst; consumer-driven market place; electronics industry; system in package; system on chip; Consumer electronics; Cost function; Digital integrated circuits; Electronics industry; Electronics packaging; Integrated circuit packaging; Micromechanical devices; Power engineering and energy; System-on-a-chip; Technological innovation;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441548

Filename

4441548