The International Roadmap for Semiconductors 2007

The international roadmap for semiconductors will have major revisions for 2007 when it is published in December. In 2007 there will be a major rewrite of the ITRS with important changes in every chapter. The assembly and packaging chapter is the integrator of components from all other working groups. A result of tins integration role is that progress in each area is both enabling and demanding significant change in the way we assemble and package semiconductors to deliver solutions to a consumer driven market place. The most significant change is the rapid growth in 3D integration and system in package (SiP) technology. The enabling technologies include wafer thinning, wafer to wafer and die to wafer bonding, through silicon vias and many more. The projections for progress in these areas to be included in the 2007 version of the ITRS will be presented.