• DocumentCode
    2905906
  • Title

    Y. C. Lee

  • fYear
    2007
  • fDate
    14-17 Aug. 2007
  • Firstpage
    1
  • Lastpage
    1
  • Keywords
    Electronic packaging thermal management; Electronics packaging; Mechanical engineering; Micromechanical devices; Nanobioscience; Nanoelectromechanical systems; Nanomaterials; Systems biology; Thermal management; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1392-8
  • Electronic_ISBN
    978-1-4244-1392-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2007.4441561
  • Filename
    4441561
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2905906