Title :
Packaging and Microelectromechanical Systems (MEMS)
Author_Institution :
Colorado Univ., Boulder
Abstract :
Packaging is critical to the advancement of microsystems integrating microelectromechanical systems (MEMS) with microelectronic, optoelectronic and microwave devices. This paper discusses microsystems packaging with three cases: a) packaging of MEMS: flip-chip assembly to interconnect MEMS devices with other components; b) packaging for MEMS: novel MEMS devices fabricated using packaging technologies such as flexible circuit; and c) MEMS for packaging: MEMS devices used for active alignment for optoelectronic packaging. With such a close relationship between packaging and MEMS, we expect to see many novel microsystems with packaging and MEMS technologies fully integrated in the future.
Keywords :
electronics packaging; flip-chip devices; micromechanical devices; optoelectronic devices; MEMS; flip-chip assembly; microelectromechanical systems; microsystems packaging; optoelectronic packaging; Assembly; Flexible printed circuits; Integrated circuit interconnections; Integrated circuit technology; Microelectromechanical devices; Microelectromechanical systems; Microelectronics; Micromechanical devices; Microwave devices; Packaging;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441562
