Dr. Xiao Hu Liu [biography]

Summary form only give, as follows. A short biography of Dr. Xiao Hu Liu is presented. Dr Liu is Research Staff Member in Materials and Reliability Sciences at IBM T.J. Watson Research Center, Yorktown Heights, New York, USA. He graduated from Tsinghua University in Beijing with the B.S. degree in 1985 and the M.S. degree in 1988, respectively, both in solid mechanics from Department of Engineering Mechanics. He received the Ph.D. in Engineering from Brown University, Providence, Rhode Island, USA, in 1997. Before he joined IBM in 1999, he had been a post-doc research associate in the Mechanical and Aerospace Engineering Department at Princeton University. His research focuses on the thermo-mechanics and the thermal issues of materials in silicon technology and the reliability of interconnects. He has been involved in the strain engineering for device performance, the copper/low-k interconnect, and the chip package interaction. His current research is to advance the interconnect technology to ultra low-k and to explore innovative interconnect technologies for future chips.