Title :
Independent Intellectual Property Product LIP Package of Huatian Technology
Author_Institution :
Tianshui Huatian Technol. Co. Ltd., Tianshui
Abstract :
This work reviews the LIP packaging application in the company of Huatian Technology.
Keywords :
industrial property; integrated circuit packaging; Huatian Technology; LIP package; LIP packaging application; independent intellectual property product; lead in package; Costs; Delamination; Electronics packaging; Etching; Heat sinks; Integrated circuit packaging; Intellectual property; Lead; Space technology; Temperature;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441573
