DocumentCode :
2906127
Title :
"More than Moore" - The changing international landscape, strategy and solutions of micro/nanoelectronics
Author :
Zhang, G.Q.
Author_Institution :
Prof., NXP Semiconductors, and Delft University of Technology, The Netherlands
fYear :
2007
fDate :
14-17 Aug. 2007
Firstpage :
1
Lastpage :
1
Abstract :
In the past decades, the main stream of microelectronics progresses is mainly powered by Moore\´s law, with two focused development arenas, namely, IC miniaturization down to nano scale, and SoC based system integration. While microelectronics community continues to invent new solutions around the world to keep Moore\´s law alive, there is increasing momentum for the development of "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies but do not simply scale with Moore\´s law. Typical examples are RF, Power/HV, Passive, Sensor/Actuator/MEMS, Bio-chi/packages, SiP, SSL. This increasing momentum of MtM is trigged by the increasing social needs for high level heterogeneous system integration including non-digital functions, the necessity to speed up innovative product creation and to broaden the product portfolio of wafer fabs, and the limiting cost and time factors of advanced SoC development. It is believed that MtM will add value to society on top of and beyond advanced CMOS and conventional packaging, with fast increasing marketing potentials. This two hours course will cover mainly: - Technology development trends of Micro/nanoelectronics - Business development trends of Micro/nanoelectronics - Strategic research agenda of "More than Moore" - Paradigm of "More than Moore" business creation - European\´s vision, strategy and practices for micro/nanoelectronics
Keywords :
Actuators; Biosensors; Microelectronics; Micromechanical devices; Moore´s Law; Nanoelectronics; Packaging; Portfolios; Radio frequency; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
Type :
conf
DOI :
10.1109/ICEPT.2007.4441574
Filename :
4441574
Link To Document :
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