• DocumentCode
    2906141
  • Title

    Reliability Challenges in Microelectronics Packaging

  • Author

    Van Driel, Willem

  • Author_Institution
    NXP Semiconductors, the Netherlands
  • fYear
    2007
  • fDate
    14-17 Aug. 2007
  • Firstpage
    1
  • Lastpage
    1
  • Keywords
    Chemical industry; Environmentally friendly manufacturing techniques; Failure analysis; Integrated circuit packaging; Integrated circuit technology; Lead; Materials reliability; Microelectronics; Semiconductor device packaging; Soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1392-8
  • Electronic_ISBN
    978-1-4244-1392-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2007.4441575
  • Filename
    4441575
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2906141