DocumentCode :
2906141
Title :
Reliability Challenges in Microelectronics Packaging
Author :
Van Driel, Willem
Author_Institution :
NXP Semiconductors, the Netherlands
fYear :
2007
fDate :
14-17 Aug. 2007
Firstpage :
1
Lastpage :
1
Keywords :
Chemical industry; Environmentally friendly manufacturing techniques; Failure analysis; Integrated circuit packaging; Integrated circuit technology; Lead; Materials reliability; Microelectronics; Semiconductor device packaging; Soldering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
Type :
conf
DOI :
10.1109/ICEPT.2007.4441575
Filename :
4441575
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2906141
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