DocumentCode :
2906251
Title :
In-situ study of acoustomigration by scanning acoustic force microscopy
Author :
Hesjedal, T. ; Kubat, F. ; Mohanty, J. ; Ruile, W. ; Reindl, L.
Author_Institution :
Paul Drude Inst., Berlin, Germany
Volume :
2
fYear :
2003
fDate :
5-8 Oct. 2003
Firstpage :
1483
Abstract :
High-power operation of surface acoustic wave devices may lead to stress induced material transport, so-called acoustomigration. We used scanning acoustic force microscopy (SAFM) to study acoustomigration of metal structures in-situ, i.e. during the high-power loading of the device. SAFM allows for the simultaneous measurement of the acoustic wavefield and the topography with submicron lateral resolution. We present acoustic wavefield and topographic image sequences giving a clear insight into the nature of the film damage on a submicron scale. The 900 MHz test structures were fabricated on 36°YX-LiTaO3 incorporating 420 nm tick Al electrodes. By correlating the acoustic wavefield mapping and the local changes in the topography point-by-point, already the initial changes of the granular structure that lead to acoustomigration can be visualized.
Keywords :
acoustic microscopy; electromigration; scanning probe microscopy; surface acoustic wave devices; 420 nm; 900 MHz; LiTaO; acoustic wavefield mapping; acoustomigration; film damage; granular structure; high-power operation; in-situ study; metal structures; scanning acoustic force microscopy; stress induced material transport; submicron lateral resolution; submicron scale; surface acoustic wave devices; test structures; topographic image sequences; Acoustic devices; Acoustic materials; Acoustic measurements; Acoustic testing; Acoustic waves; Image sequences; Microscopy; Stress; Surface acoustic wave devices; Surface topography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
Type :
conf
DOI :
10.1109/ULTSYM.2003.1293186
Filename :
1293186
Link To Document :
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