• DocumentCode
    2906377
  • Title

    System-on-a-chip global interconnect optimization

  • Author

    Naeemi, Azad ; Venkatesan, Raguraman ; Meindl, James D.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2002
  • fDate
    25-28 Sept. 2002
  • Firstpage
    399
  • Lastpage
    403
  • Abstract
    The width of global interconnects is optimized to have a large bisectional bandwidth along with a small latency, power dissipation, repeater area and via blockage. The optimal wire width, which maximizes the product of data flux density OD and reciprocal delay 1/τ, is independent of the interconnect length and can be used for all global interconnects. Data flux density OD (per unit width) determines the bisectional bandwidth and therefore, the total number of bits per second that global interconnect levels can potentially transfer. Using optimal wire width decreases the latency, energy dissipation, and repeater area by 42%, 30%, and 84%, respectively compared to using half the optimal wire width at the price of 14% smaller bisectional bandwidth.
  • Keywords
    circuit optimisation; delays; integrated circuit design; low-power electronics; repeaters; system-on-chip; bisectional bandwidth; data flux density; energy dissipation; global interconnect width; interconnect length; latency; optimal wire width; power dissipation; reciprocal delay; repeater area; system-on-a-chip global interconnect optimization; transfer rate; via blockage; Bandwidth; Capacitance; Clocks; Conductivity; Delay; Frequency; Power system interconnection; Repeaters; System-on-a-chip; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC/SOC Conference, 2002. 15th Annual IEEE International
  • Print_ISBN
    0-7803-7494-0
  • Type

    conf

  • DOI
    10.1109/ASIC.2002.1158092
  • Filename
    1158092