DocumentCode
2906377
Title
System-on-a-chip global interconnect optimization
Author
Naeemi, Azad ; Venkatesan, Raguraman ; Meindl, James D.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2002
fDate
25-28 Sept. 2002
Firstpage
399
Lastpage
403
Abstract
The width of global interconnects is optimized to have a large bisectional bandwidth along with a small latency, power dissipation, repeater area and via blockage. The optimal wire width, which maximizes the product of data flux density OD and reciprocal delay 1/τ, is independent of the interconnect length and can be used for all global interconnects. Data flux density OD (per unit width) determines the bisectional bandwidth and therefore, the total number of bits per second that global interconnect levels can potentially transfer. Using optimal wire width decreases the latency, energy dissipation, and repeater area by 42%, 30%, and 84%, respectively compared to using half the optimal wire width at the price of 14% smaller bisectional bandwidth.
Keywords
circuit optimisation; delays; integrated circuit design; low-power electronics; repeaters; system-on-chip; bisectional bandwidth; data flux density; energy dissipation; global interconnect width; interconnect length; latency; optimal wire width; power dissipation; reciprocal delay; repeater area; system-on-a-chip global interconnect optimization; transfer rate; via blockage; Bandwidth; Capacitance; Clocks; Conductivity; Delay; Frequency; Power system interconnection; Repeaters; System-on-a-chip; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC/SOC Conference, 2002. 15th Annual IEEE International
Print_ISBN
0-7803-7494-0
Type
conf
DOI
10.1109/ASIC.2002.1158092
Filename
1158092
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