Finite element analysis of the substrate thickness effect on travelling leaky surface acoustic waves

Author

Yoon, S. ; Yu, J.-D. ; Kanna, S. ; Oshio, M. ; Tanaka, M.

Author_Institution

Epson R&D Inc., San Jose, CA, USA

Volume

2

fYear

2003

fDate

5-8 Oct. 2003

Firstpage

1696

Abstract

A FE method is developed for analysis of travelling LSAWs. Because of the use of the general eigenvalue problem with Hermitian coefficient matrices needs to be solved. A publicly available eigenvalue solver ARPACK, together with the shift and invert spectral transformation, is used to solve the problem efficiently. The effect of the finite thickness of substrates on the dispersion behaviour of LSAWs is simulated.

Keywords

Hermitian matrices; boundary-elements methods; eigenvalues and eigenfunctions; finite element analysis; spectral analysis; substrates; surface acoustic wave devices; ARPACK; Hermitian coefficient matrices; dispersion behaviour; eigenvalue solver; finite element analysis; general eigenvalue problem; invert spectral transformation; shift spetrac transformation; substrate finite thickness; substrate thickness effect; travelling leaky surface acoustic waves; Acoustic waves; Boundary conditions; Eigenvalues and eigenfunctions; Electrodes; Equations; Finite element methods; Frequency; Geometry; Periodic structures; Surface acoustic waves;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics, 2003 IEEE Symposium on

Print_ISBN

0-7803-7922-5

Type

conf

DOI

10.1109/ULTSYM.2003.1293237

Filename

1293237