Title :
In-tier diagnosis of power domains in 3D TSV ICs
Author :
Araga, Yuuki ; Nagata, Makoto ; Van der Plas, Geert ; Kim, Jaemin ; Minas, Nikolaos ; Marchal, Pol ; Travaly, Youssef ; Libois, Michael ; Manna, Antonio La ; Zhang, Wenqi ; Beyne, Eric
Author_Institution :
Grad. Sch. of Syst. Inf., Kobe Univ., Kobe, Japan
fDate :
Jan. 31 2012-Feb. 2 2012
Abstract :
Power and substrate domains are strategically isolated or unified in heterogeneous 3D integration. In-tier probing circuitry provides accessibility to power delivery and substrate networks in a deep tier of a 3D chip stack and capability of diagnosing intra/inter tier coupling. A two-tier demonstrator was successfully tested in a 130 nm CMOS, 3D-SIC Cu TSV technology.
Keywords :
copper; three-dimensional integrated circuits; 3D chip stack; 3D stacked IC approach; 3D-SIC copper TSV technology; Cu; heterogeneous 3D integration; in-tier probing circuitry; intertier coupling; intratier coupling; power domain in-tier diagnosis; size 130 nm; substrate networks; two-tier demonstrator; Couplings; Noise; Noise measurement; Substrates; Through-silicon vias; Vehicles; Wiring;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2011 IEEE International
Conference_Location :
Osaka
Print_ISBN :
978-1-4673-2189-1
DOI :
10.1109/3DIC.2012.6262964
