DocumentCode
2907343
Title
Integration of self assembly for semiconductor microelectronics
Author
Black, C.T.
Author_Institution
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2005
fDate
18-21 Sept. 2005
Firstpage
87
Lastpage
91
Abstract
Self assembling polymers can autonomously form regular patterns at sublithographic dimensions. Integration of these materials with semiconductor processing enables high-resolution patterning of microelectronic circuit elements and offers a nontraditional pathway for continued improvements in integrated circuit performance. We discuss our efforts in IBM to demonstrate key applications of self assembly for semiconductor device fabrication.
Keywords
integrated circuit design; integrated circuit manufacture; lithography; nanoelectronics; nanopatterning; polymers; self-assembly; microelectronic circuit elements; pattern formation; self assembling polymers; self assembly; semiconductor device fabrication; semiconductor microelectronics; semiconductor processing; sublithographic dimensions; Circuits; Etching; FETs; Fabrication; Microelectronics; Polymers; Resists; Self-assembly; Semiconductor materials; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 2005. Proceedings of the IEEE 2005
Print_ISBN
0-7803-9023-7
Type
conf
DOI
10.1109/CICC.2005.1568615
Filename
1568615
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