DocumentCode :
2907492
Title :
A miniature BAW duplexer using flip-chip on LTCC
Author :
Marksteiner, S. ; Handtmann, M. ; Timme, H.-J. ; Aigner, R. ; Welzer, R. ; Portmann, J. ; Bauernschmitt, U.
Author_Institution :
Infineon Technol. AG, Munich, Germany
Volume :
2
fYear :
2003
fDate :
5-8 Oct. 2003
Firstpage :
1794
Abstract :
The challenge for developing a duplexer for US-PCS mobile phones comes from the close proximity of TX and RX pass bands as well as from very stringent rejection and isolation requirements. Until recently, only rather bulky ceramic filters were able to provide the necessary performance. However, the need for smaller footprint and device height has brought up competing technologies based on SAW according to T. Matsuda et al. (2002) and FBAR by J. D. Larson et al. (1999) and P. D. Bradley et al. (2002) filters. We present experimental results on a PCS duplexer derived from combining a high-Q solidly mounted BAW technology by R. Aigner et al. (2002) with a flip-chip-on-LTCC package (CSSPlus). The ground inductances of the filters were carefully tuned to maintain excellent attenuation up to 3.4 GHz. Due to high resonator Q>1200 the filters have roll-offs <1500 MHz. A low TCF of only -19 ppm/K has been achieved. The resulting duplexer has small footprint (5 × 5 mm2) and height (<1.3 mm). An insertion loss <3 dB, TX-to-RX isolation >40 dB in the RX band and >50 dB in the TX band have been demonstrated.
Keywords :
bulk acoustic wave devices; ceramics; flip-chip devices; mobile handsets; surface acoustic waves; FBAR filters; LTCC; PCS duplexer; SAW filters; US-PCS mobile phones; ceramic filters; device height; flip-chip; ground inductances; isolation requirements; miniature BAW duplexer; pass bands; rejection requirements; smaller footprint; Attenuation; Band pass filters; Ceramics; Film bulk acoustic resonators; Isolation technology; Mobile handsets; Packaging; Personal communication networks; Resonator filters; Surface acoustic waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
Type :
conf
DOI :
10.1109/ULTSYM.2003.1293261
Filename :
1293261
Link To Document :
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