Title :
On-chip temperature control circuit using common devices
Author :
Braun, Frank D. ; Parent, David W. ; Papalias, Tamara A.
Author_Institution :
San Jose State Univ., CA, USA
Abstract :
A circuit has been designed to control the temperature of the IC die upon which it resides. No special devices or layers are required. No external circuitry or special heat sinking is used. Equilibrium temperatures from below -40°C to above +85°C are attainable. Time to equilibrium is on the order of a few seconds. The 400μm × 500μm circuit has been manufactured by the MOSIS service in a TSMC 0.25 micron process and installed in a 40-pin DIP package. Test results reveal temperature regulation within 0.3°C for thermal control ranges of 4°C to 40°C.
Keywords :
MOS analogue integrated circuits; temperature control; 0.25 micron; 4 to 40 C; MOSIS service; analog integrated circuits; integrated circuit die; on-chip temperature control circuit; Circuit testing; Diodes; Electronics packaging; Heating; Impedance; Negative feedback; Operational amplifiers; Temperature control; Temperature distribution; Voltage;
Conference_Titel :
Custom Integrated Circuits Conference, 2005. Proceedings of the IEEE 2005
Print_ISBN :
0-7803-9023-7
DOI :
10.1109/CICC.2005.1568645
