Title :
Mechanical and electrical reliability of copper interconnections for 3DIC
Author :
Saito, Naoki ; Murata, Naokazu ; Tamakawa, Kinji ; Suzuki, Ken ; Miura, Hideo
Author_Institution :
Fracture & Reliability Res. Inst., Tohoku Univ., Sendai, Japan
fDate :
Jan. 31 2012-Feb. 2 2012
Abstract :
The mechanical and electrical properties of electroplated copper thin films were found to vary drastically depending on their electroplating conditions and thermal history after electroplating. The change of their microstructure was the main reason for the variation. The crystallinity of the micro texture was evaluated quantitatively by applying an electron back-scattering diffraction method.
Keywords :
copper; electron backscattering; electroplating; integrated circuit interconnections; integrated circuit reliability; three-dimensional integrated circuits; 3D IC; copper interconnections; electrical reliability; electron back-scattering diffraction method; electroplated copper thin films; mechanical reliability; microtexture crystallinity; thermal history; Annealing; Copper; Current density; Fatigue; Films; Grain boundaries; Surface cracks;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2011 IEEE International
Conference_Location :
Osaka
Print_ISBN :
978-1-4673-2189-1
DOI :
10.1109/3DIC.2012.6262998
