• DocumentCode
    2908164
  • Title

    Fabrication and characterization of a new capacitive micromachined ultrasonic transducer (cMUT) using polysilicon as membrane and sacrificial layer material

  • Author

    Buhrdorf, A. ; Lohfink, A. ; Junge, S. ; Eccardt, P.-C. ; Benecke, W.

  • Author_Institution
    IMSAS, Bremen Univ., Germany
  • Volume
    2
  • fYear
    2003
  • fDate
    5-8 Oct. 2003
  • Firstpage
    1951
  • Abstract
    This paper presents a new type of capacitive micromachined ultrasonic transducer (cMUT) using polysilicon for the membrane as well as for the sacrificial layer. Further features are the structured metallic bottom electrode, a silicon oxide isolation layer and a low stress polysilicon membrane combined with a defined electrically doped area. Moreover, the device is completely fabricated using surface micromachining technology. This technology has been applied to fabricate 1D cMUT arrays for operation in fluids in the range of 5 - 15 MHz. the characterization of the fabricated cMUTs have been performed by using optical LDV measurements of the membrane deflection in air using CW mode, LDV measurements in water burst operation mode and acoustic field measurements in water using hydrophone.
  • Keywords
    capacitive sensors; micromachining; pressure sensors; silicon compounds; ultrasonic machining; ultrasonic transducers; 5 to 15 MHz; CW mode; acoustic field measurements; burst operation mode; capacitive micromachined ultrasonic transducer; hydrophone; membrane deflection; membrane material; metallic bottom electrode; optical LDV measurements; polysilicon membrane; pressure sensor; sacrificial layer material; silicon oxide isolation layer; surface micromachining; ultrasonic membrane cell; Acoustic measurements; Biomembranes; Electrodes; Fabrication; Isolation technology; Micromachining; Optical arrays; Silicon; Stress; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics, 2003 IEEE Symposium on
  • Print_ISBN
    0-7803-7922-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2003.1293299
  • Filename
    1293299