DocumentCode :
2908383
Title :
Fabrication of piezoelectric thick films for high frequency transducers
Author :
Xu, Baomin ; Buhler, Steve ; White, David ; Zesch, James ; Wong, William
Author_Institution :
Palo Alto Res. Center Inc., CA, USA
Volume :
2
fYear :
2003
fDate :
5-8 Oct. 2003
Firstpage :
1999
Abstract :
Piezoelectric PZT thick film elements have been fabricated by using a screen printing laser liftoff process, with film thickness from 20 to 100μm. Various patterns were screen printed on a sapphire substrate and sintered at 1250°C for densification. After sintering, the PZT elements were bonded to a final target substrate, which could be a backing material for ultrasonic transducers. Next, the PZT elements were released from the sapphire substrate. This process has the potential to make large quantities of thick film elements and arrays at very low cost. The obtained films have a free dielectric constant of about 2000, remnant polarization of 39.8μC/cm2, thickness-mode coupling factor of about 0.49, and are very promising for making high frequency transducers.
Keywords :
densification; piezoelectric materials; sapphire; sintering; substrates; thick films; ultrasonic transducers; 1250 C; 20 to 100 micron; PZT element bonding; backing material; densification; film thickness; free dielectric constant; high frequency transducers; piezoelectric PZT thick film elements; piezoelectric thick film fabrication; remnant polarization; sapphire substrate; screen printing laser liftoff; sintering; target substrate; thickness-mode coupling factor; ultrasonic transducers; Bonding; Dielectric materials; Dielectric substrates; Frequency; Laser sintering; Optical device fabrication; Piezoelectric films; Piezoelectric transducers; Printing; Thick films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
Type :
conf
DOI :
10.1109/ULTSYM.2003.1293309
Filename :
1293309
Link To Document :
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