DocumentCode
2909317
Title
Testing of MEMS material properties and stability
Author
Brown, Stuart B. ; Muhlstein, Christopher ; Chui, Clarence ; Abnet, Catneron
Author_Institution
Xponent Ailure Anal. Associates, Natick, MA, USA
fYear
1998
fDate
24-27 Aug 1998
Firstpage
161
Lastpage
162
Abstract
This article presents progress in characterizing MEMS failure. The results are applicable to a wide range of materials and applications. Data is presented, however, for MEMS polysilicon and single crystal silicon. The observations of fatigue crack growth in single crystal silicon and time dependent crack initiation in polysilicon are important because they indicate MEMS failure modes that have not been previously recognized. The effects of microstructure, environment, and fabrication can become significant on the micro scale even when they are irrelevant in larger, macroscale structures. The microstructure of MEMS devices is also different from that of large bodies of the same material
Keywords
crack detection; elemental semiconductors; failure (mechanical); fault diagnosis; materials testing; micromechanical devices; silicon; MEMS failure modes; MEMS material properties; Si; fatigue crack growth; macroscale structures; microstructure; polysilicon; single crystal silico; stability; testing; time dependent crack initiation; Crystal microstructure; Crystalline materials; Fabrication; Fatigue; Material properties; Materials testing; Microelectromechanical devices; Micromechanical devices; Silicon; Stability;
fLanguage
English
Publisher
ieee
Conference_Titel
AUTOTESTCON '98. IEEE Systems Readiness Technology Conference., 1998 IEEE
Conference_Location
Salt Lake City, UT
ISSN
1088-7725
Print_ISBN
0-7803-4420-0
Type
conf
DOI
10.1109/AUTEST.1998.713437
Filename
713437
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