• DocumentCode
    2909317
  • Title

    Testing of MEMS material properties and stability

  • Author

    Brown, Stuart B. ; Muhlstein, Christopher ; Chui, Clarence ; Abnet, Catneron

  • Author_Institution
    Xponent Ailure Anal. Associates, Natick, MA, USA
  • fYear
    1998
  • fDate
    24-27 Aug 1998
  • Firstpage
    161
  • Lastpage
    162
  • Abstract
    This article presents progress in characterizing MEMS failure. The results are applicable to a wide range of materials and applications. Data is presented, however, for MEMS polysilicon and single crystal silicon. The observations of fatigue crack growth in single crystal silicon and time dependent crack initiation in polysilicon are important because they indicate MEMS failure modes that have not been previously recognized. The effects of microstructure, environment, and fabrication can become significant on the micro scale even when they are irrelevant in larger, macroscale structures. The microstructure of MEMS devices is also different from that of large bodies of the same material
  • Keywords
    crack detection; elemental semiconductors; failure (mechanical); fault diagnosis; materials testing; micromechanical devices; silicon; MEMS failure modes; MEMS material properties; Si; fatigue crack growth; macroscale structures; microstructure; polysilicon; single crystal silico; stability; testing; time dependent crack initiation; Crystal microstructure; Crystalline materials; Fabrication; Fatigue; Material properties; Materials testing; Microelectromechanical devices; Micromechanical devices; Silicon; Stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    AUTOTESTCON '98. IEEE Systems Readiness Technology Conference., 1998 IEEE
  • Conference_Location
    Salt Lake City, UT
  • ISSN
    1088-7725
  • Print_ISBN
    0-7803-4420-0
  • Type

    conf

  • DOI
    10.1109/AUTEST.1998.713437
  • Filename
    713437