• DocumentCode
    2909817
  • Title

    Loosely coupled memory-based decoding architecture for low density parity check codes

  • Author

    Kang, Se-Hyeon ; Park, In-Cheol

  • Author_Institution
    Dept. of EECS, Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • fYear
    2005
  • fDate
    18-21 Sept. 2005
  • Firstpage
    703
  • Lastpage
    706
  • Abstract
    Parallel decoding is required for low density parity check (LDPC) codes to achieve high decoding throughput, but it suffers from a large set of registers and complex interconnections due to randomly located 1´s in the sparse parity check matrix. This paper proposes a new LDPC decoding architecture to reduce registers and alleviate complex interconnections. To reduce the number of messages to be exchanged among processing units, two data flows that can be loosely coupled are developed by allowing duplicated operations. In addition, a partially parallel architecture is proposed to promote the memory usage and an efficient algorithm that schedules the processing order of the partially parallel architecture is also proposed to reduce the overall processing time by overlapping operations. To verify the proposed architecture, a 1024 bit rate-1/2 LDPC decoder is designed using a 0.18 μm CMOS process. The decoder occupies an area of 10.08mm2 and provides almost 1Gbps decoding throughput at the frequency of 200MHz.
  • Keywords
    CMOS integrated circuits; decoding; memory architecture; parallel architectures; parity check codes; 0.18 micron; 1024 bit; 200 MHz; CMOS process; LDPC codes; LDPC decoding architecture; data flows; loosely coupled memory; low density parity check codes; parallel decoding; partially parallel architecture; sparse parity check matrix; Bit rate; CMOS process; Decoding; Memory architecture; Parallel architectures; Parity check codes; Registers; Scheduling algorithm; Sparse matrices; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2005. Proceedings of the IEEE 2005
  • Print_ISBN
    0-7803-9023-7
  • Type

    conf

  • DOI
    10.1109/CICC.2005.1568765
  • Filename
    1568765