DocumentCode :
2910962
Title :
Simulation of capacitive micromachined ultrasonic transducers (cMUT) for low frequencies and silicon condenser microphones using an analytical model
Author :
Junge, S. ; Tebje, L. ; Buhrdorf, A. ; Benecke, W.
Author_Institution :
Inst. for Microsensors, -Actuators & -Syst., Bremen Univ., Germany
Volume :
1
fYear :
2003
fDate :
5-8 Oct. 2003
Firstpage :
485
Abstract :
Silicon micromachining is a promising approach to realize low frequency capacitive ultrasonic transducers and condenser microphones. The construction of micromachined low frequency capacitive ultrasonic transducers or microphones, respectively, differs considerably from that used for high frequency cMUTs. This paper presents an analytical model used for the simulation. The effects of different airgap geometry and backplate perforation on frequency response and sensitivity for transducers in the audible and ultrasonic frequency range will be shown. Finally optimization criteria are discussed considering the maximum receiving sensitivity and the resonance frequency shifting of the membrane due to the effect of the backvolume.
Keywords :
capacitive sensors; elemental semiconductors; frequency response; micromechanical devices; microphones; silicon; ultrasonic transducers; Si; airgap geometry; backplate perforation; capacitive micromachined ultrasonic transducers; frequency response; low frequency capacitive ultrasonic transducers; resonance frequency shifting; silicon condenser microphones; silicon micromachining; transducers sensitivity; Analytical models; Biomembranes; Frequency response; Geometry; Micromachining; Microphones; Resonance; Resonant frequency; Silicon; Ultrasonic transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
Type :
conf
DOI :
10.1109/ULTSYM.2003.1293450
Filename :
1293450
Link To Document :
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