• DocumentCode
    2910962
  • Title

    Simulation of capacitive micromachined ultrasonic transducers (cMUT) for low frequencies and silicon condenser microphones using an analytical model

  • Author

    Junge, S. ; Tebje, L. ; Buhrdorf, A. ; Benecke, W.

  • Author_Institution
    Inst. for Microsensors, -Actuators & -Syst., Bremen Univ., Germany
  • Volume
    1
  • fYear
    2003
  • fDate
    5-8 Oct. 2003
  • Firstpage
    485
  • Abstract
    Silicon micromachining is a promising approach to realize low frequency capacitive ultrasonic transducers and condenser microphones. The construction of micromachined low frequency capacitive ultrasonic transducers or microphones, respectively, differs considerably from that used for high frequency cMUTs. This paper presents an analytical model used for the simulation. The effects of different airgap geometry and backplate perforation on frequency response and sensitivity for transducers in the audible and ultrasonic frequency range will be shown. Finally optimization criteria are discussed considering the maximum receiving sensitivity and the resonance frequency shifting of the membrane due to the effect of the backvolume.
  • Keywords
    capacitive sensors; elemental semiconductors; frequency response; micromechanical devices; microphones; silicon; ultrasonic transducers; Si; airgap geometry; backplate perforation; capacitive micromachined ultrasonic transducers; frequency response; low frequency capacitive ultrasonic transducers; resonance frequency shifting; silicon condenser microphones; silicon micromachining; transducers sensitivity; Analytical models; Biomembranes; Frequency response; Geometry; Micromachining; Microphones; Resonance; Resonant frequency; Silicon; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics, 2003 IEEE Symposium on
  • Print_ISBN
    0-7803-7922-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2003.1293450
  • Filename
    1293450