DocumentCode
2911053
Title
Structural Patterns for Soundness of Business Process Models
Author
Van Dongen, Boudewijn F. ; Mendling, J. ; van der Aalst, Wil M. P.
Author_Institution
Dept. of Technol. Manage., Eindhoven Univ. of Technol.
fYear
2006
fDate
Oct. 2006
Firstpage
116
Lastpage
128
Abstract
The correctness of business process models is of paramount importance for the application on an enterprise level. A severe problem is that several languages for business process modelling do not have formal execution semantics which is a prerequisite to check correctness criteria. In this context, soundness defines a minimum correctness criterion that a process model should fulfil. In this paper we present a novel approach to reason about soundness based on so-called causal footprints. A causal footprint represents a set of conditions on the order of activities that holds for every case of a process model. We identify three kinds of error patterns that affect the soundness of a process model, namely the deadlock pattern, the multiple termination pattern, and the trap pattern. We use event-driven process chains (EPCs) and Petri nets to demonstrate the applicability of our approach for both conceptual as for formal process modelling languages. Furthermore, it can easily be applied to other languages, such as UML activity diagrams or BPEL. Based on the trap pattern, we prove that the "vicious circle", that is heavily discussed in EPC literature, is unsound
Keywords
Petri nets; business data processing; corporate modelling; Petri nets; business process modelling; causal footprints; deadlock pattern; event-driven process chains; formal process modelling languages; minimum correctness criterion; multiple termination pattern; structural patterns; trap pattern; Context modeling; Engines; Large-scale systems; Pattern analysis; Petri nets; Runtime; State-space methods; System recovery; Technology management; Unified modeling language;
fLanguage
English
Publisher
ieee
Conference_Titel
Enterprise Distributed Object Computing Conference, 2006. EDOC '06. 10th IEEE International
Conference_Location
Hong Kong
ISSN
1541-7719
Print_ISBN
0-7695-2558-X
Type
conf
DOI
10.1109/EDOC.2006.56
Filename
4031201
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