Title :
Three-dimensional MMIC technology for low-cost millimeter-wave MMICs
Author :
Nishikawa, K. ; Kamogawa, K. ; Tokumitsu, M. ; Toyoda, I. ; Sugitani, S. ; Araki, K.
Author_Institution :
NTT Network Innovation Labs., Yokosuka, Japan
Abstract :
This paper highlights the key advantages of the three-dimensional (3D) MMIC technology in the millimeter-wave frequency band and demonstrates recently developed compact 3DMMICs. This paper also proposes a new methodology for MMIC development based on 3D/multilayer MMIC technology that greatly reduces the costs of millimeter-wave MMICs. The new technology achieves compact and highly integrated millimeter-wave MMICs that are extremely cost effective.
Keywords :
MIMIC; cost; millimeter-wave MMIC; three-dimensional multilayer technology; Costs; Dielectric substrates; Fabrication; Insulation; MMICs; Metal-insulator structures; Microstrip; Millimeter wave radar; Millimeter wave technology; Polyimides;
Conference_Titel :
GaAs IC Symposium, 2000. 22nd Annual
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-5968-2
DOI :
10.1109/GAAS.2000.906312