DocumentCode
2912009
Title
Three-dimensional MMIC technology for low-cost millimeter-wave MMICs
Author
Nishikawa, K. ; Kamogawa, K. ; Tokumitsu, M. ; Toyoda, I. ; Sugitani, S. ; Araki, K.
Author_Institution
NTT Network Innovation Labs., Yokosuka, Japan
fYear
2000
fDate
5-8 Nov. 2000
Firstpage
153
Lastpage
156
Abstract
This paper highlights the key advantages of the three-dimensional (3D) MMIC technology in the millimeter-wave frequency band and demonstrates recently developed compact 3DMMICs. This paper also proposes a new methodology for MMIC development based on 3D/multilayer MMIC technology that greatly reduces the costs of millimeter-wave MMICs. The new technology achieves compact and highly integrated millimeter-wave MMICs that are extremely cost effective.
Keywords
MIMIC; cost; millimeter-wave MMIC; three-dimensional multilayer technology; Costs; Dielectric substrates; Fabrication; Insulation; MMICs; Metal-insulator structures; Microstrip; Millimeter wave radar; Millimeter wave technology; Polyimides;
fLanguage
English
Publisher
ieee
Conference_Titel
GaAs IC Symposium, 2000. 22nd Annual
Conference_Location
Seattle, WA, USA
ISSN
1064-7775
Print_ISBN
0-7803-5968-2
Type
conf
DOI
10.1109/GAAS.2000.906312
Filename
906312
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