DocumentCode :
2912460
Title :
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456)
fYear :
2000
fDate :
7-7 Dec. 2000
Abstract :
The following topics were dealt with: green packaging materials; packaging trends; thermal design; solder joints; process modelling; thermal characterization; materials characterization; assembly; underfill; package reliability; thermomechanical modelling; interconnection; substrate technology; and cooling
Keywords :
assembling; cooling; design engineering; interconnections; packaging; reliability; soldering; thermal analysis; assembly; cooling; green packaging materials; interconnection; materials characterization; package reliability; packaging trends; process modelling; solder joints; substrate technology; thermal characterization; thermal design; thermomechanical modelling; underfill;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Conference_Location :
Singapore
Print_ISBN :
0-7803-6644-1
Type :
conf
DOI :
10.1109/EPTC.2000.906338
Filename :
906338
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2912460
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