Green packages-requirements, materials, results

Green packages, i.e. lead-free and halogen-free semiconductor components, require the evaluation of a lot of new materials and processes. Results with regard to solder plating, ball attach and the properties of halogen-free mold compounds are introduced. It is shown that the materials are available and work well, aside from some improvements which must be made. The ball attach temperature and shear strength of lead-free solder balls meet the process requirements. Solder plating cannot produce the same wetting behaviour for SnPb plating as compared to conventional SnPb soldering, but works well with lead-free solders. Halogen free mold compounds offer a good chance to replace halogenated flame retardants