DocumentCode
2912664
Title
SiGe BiCMOS Chip Sets for Use in an X-Band Multi-function Chip
Author
Jeong, Jin-Cheol ; Yom, In-Bok
Author_Institution
Satellite & Wireless Convergence Res. Dept., ETRI, Daejeon, South Korea
fYear
2010
fDate
13-19 June 2010
Firstpage
25
Lastpage
30
Abstract
SiGe Radio Frequency Integrated Circuits have been designed and fabricated for use in the X-band Si-based multi-function chip, which is known as a core-chip for a Transmit/Receive module of a phased array radar systems. In this paper, six kinds of Radio Frequency Integrated Circuits will be presented such as a power amplifier, a digital serial-to-parallel converter, a Single-Pole-Double-Throw switch, an 8 dB attenuator, a 16 dB attenuator, and a 45 degree phase shifter. The power amplifier based on a cascode configuration using SiGe HBTs shows the Radio Frequency performance of the 12 dB gain and 19 dBm P1dB. The other five chips have been designed using 0.25 um Complementary Metal-Oxide Semiconductor technology. The digital serial-to-parallel converter shows the perfect functional operation to 20 MHz clock. The Single-Pole-Double-Throw switch, the 8 dB and 16 dB attenuations, and the 45 degree phase shifter show good Radio Frequency performances. The most of chip sizes are very small to be lower than 1 mm2. These chip sets may make an attractive solution for a high power X-band multi-function chip for a T/R module of a phased array radar system.
Keywords
BiCMOS integrated circuits; CMOS integrated circuits; Ge-Si alloys; heterojunction bipolar transistors; phased array radar; power amplifiers; radiofrequency integrated circuits; semiconductor materials; BiCMOS chip; HBT; SiGe; X-band multifunction chip; cascode configuration; digital serial-to-parallel converter; phased array radar systems; power amplifier; radio frequency integrated circuits; single-pole-double-throw switch; size 0.25 mum; transmit-receive module; Attenuators; BiCMOS integrated circuits; Germanium silicon alloys; Phased arrays; Power amplifiers; Radar; Radiofrequency amplifiers; Radiofrequency integrated circuits; Silicon germanium; Switches; CMOS; Multi-function Chip; RFIC; SiGe; X-band;
fLanguage
English
Publisher
ieee
Conference_Titel
Advances in Satellite and Space Communications (SPACOMM), 2010 Second International Conference on
Conference_Location
Athens
Print_ISBN
978-1-4244-7275-8
Type
conf
DOI
10.1109/SPACOMM.2010.12
Filename
5502633
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