• DocumentCode
    2912664
  • Title

    SiGe BiCMOS Chip Sets for Use in an X-Band Multi-function Chip

  • Author

    Jeong, Jin-Cheol ; Yom, In-Bok

  • Author_Institution
    Satellite & Wireless Convergence Res. Dept., ETRI, Daejeon, South Korea
  • fYear
    2010
  • fDate
    13-19 June 2010
  • Firstpage
    25
  • Lastpage
    30
  • Abstract
    SiGe Radio Frequency Integrated Circuits have been designed and fabricated for use in the X-band Si-based multi-function chip, which is known as a core-chip for a Transmit/Receive module of a phased array radar systems. In this paper, six kinds of Radio Frequency Integrated Circuits will be presented such as a power amplifier, a digital serial-to-parallel converter, a Single-Pole-Double-Throw switch, an 8 dB attenuator, a 16 dB attenuator, and a 45 degree phase shifter. The power amplifier based on a cascode configuration using SiGe HBTs shows the Radio Frequency performance of the 12 dB gain and 19 dBm P1dB. The other five chips have been designed using 0.25 um Complementary Metal-Oxide Semiconductor technology. The digital serial-to-parallel converter shows the perfect functional operation to 20 MHz clock. The Single-Pole-Double-Throw switch, the 8 dB and 16 dB attenuations, and the 45 degree phase shifter show good Radio Frequency performances. The most of chip sizes are very small to be lower than 1 mm2. These chip sets may make an attractive solution for a high power X-band multi-function chip for a T/R module of a phased array radar system.
  • Keywords
    BiCMOS integrated circuits; CMOS integrated circuits; Ge-Si alloys; heterojunction bipolar transistors; phased array radar; power amplifiers; radiofrequency integrated circuits; semiconductor materials; BiCMOS chip; HBT; SiGe; X-band multifunction chip; cascode configuration; digital serial-to-parallel converter; phased array radar systems; power amplifier; radio frequency integrated circuits; single-pole-double-throw switch; size 0.25 mum; transmit-receive module; Attenuators; BiCMOS integrated circuits; Germanium silicon alloys; Phased arrays; Power amplifiers; Radar; Radiofrequency amplifiers; Radiofrequency integrated circuits; Silicon germanium; Switches; CMOS; Multi-function Chip; RFIC; SiGe; X-band;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advances in Satellite and Space Communications (SPACOMM), 2010 Second International Conference on
  • Conference_Location
    Athens
  • Print_ISBN
    978-1-4244-7275-8
  • Type

    conf

  • DOI
    10.1109/SPACOMM.2010.12
  • Filename
    5502633