• DocumentCode
    2912725
  • Title

    Dynamic model simulation of arc formation in vacuum circuit breaker

  • Author

    Cao, Yundong ; Zhao, Jiwei ; Li, Jing ; Lin, Heng ; Liu, Xiaoming ; Sun, Peng

  • Author_Institution
    Sch. of Electr. Eng., Shenyang Univ. of Technol., Shenyang, China
  • fYear
    2010
  • fDate
    Aug. 30 2010-Sept. 3 2010
  • Firstpage
    435
  • Lastpage
    438
  • Abstract
    Based on the theories of fractal and gas discharge, microscopic morphology of vacuum arc, the process of arc formation and development of discharge channel in the vacuum circuit breaker are simulated. The effects of temperature and electromagnetic field on the arc are also considered. The opening stroke is 10 mm in our work. Voltage is 75 kV, and current is 1 kA. The effects of temperature on the arc radius, the role of self-generated magnetic fields and thermal conduction are simulated here. The results show that electron density and the coefficient of heat conduction are increased gradually. Average temperature increases at first and decreases latter, then collision coefficient enhances. The radius of arc also increases in the stage of arc formation and development. The arc radius contract and stable arc forms after breakdown.
  • Keywords
    discharges (electric); electron density; fractals; heat conduction; vacuum arcs; vacuum circuit breakers; arc radius contract; collision coefficient; current 1 kA; dynamic model simulation; electromagnetic field; electron density; fractal theory; gas discharge; heat conduction coefficient; microscopic morphology; self-generated magnetic fields; size 10 mm; temperature effect; thermal conduction; vacuum arc formation; vacuum circuit breaker; voltage 75 kV; Anodes; Discharges; Electric fields; Heating; Mathematical model; Metals; Vacuum arcs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum (ISDEIV), 2010 24th International Symposium on
  • Conference_Location
    Braunschweig
  • ISSN
    1093-2941
  • Print_ISBN
    978-1-4244-8367-9
  • Electronic_ISBN
    1093-2941
  • Type

    conf

  • DOI
    10.1109/DEIV.2010.5625765
  • Filename
    5625765