Quantitative modeling of diffusional coarsening in eutectic tin/lead solders

This paper presents a quantitative computer simulation of the coarsening phenomenon observed in eutectic tin/lead and other solder materials used for joining microelectronic components. The mathematical model is based on phase field theory and allows predicting the development of tin concentration over time within a representative volume element (RVE) of the solder. It accounts for the chemical free energy of the various phases, their surface energies as well as locally acting thermo-mechanical stresses and strains. All material parameters required stem from the literature and are based on experiments performed independently of the coarsening phenomenon and the model of this paper