Quantitative modeling of diffusional coarsening in eutectic tin/lead solders

Author

Dreyer, W. ; Muller, W.H.

Author_Institution

Weierstrass Inst. fur Angewandte Analysis und Stochastik, Berlin, Germany

fYear

2000

fDate

2000

Firstpage

117

Lastpage

123

Abstract

This paper presents a quantitative computer simulation of the coarsening phenomenon observed in eutectic tin/lead and other solder materials used for joining microelectronic components. The mathematical model is based on phase field theory and allows predicting the development of tin concentration over time within a representative volume element (RVE) of the solder. It accounts for the chemical free energy of the various phases, their surface energies as well as locally acting thermo-mechanical stresses and strains. All material parameters required stem from the literature and are based on experiments performed independently of the coarsening phenomenon and the model of this paper

Keywords

circuit simulation; eutectic alloys; free energy; integrated circuit modelling; integrated circuit packaging; internal stresses; lead alloys; soldering; surface energy; texture; thermal stresses; tin alloys; SnPb; chemical free energy; coarsening phenomenon; diffusional coarsening; eutectic tin/lead solders; locally acting thermo-mechanical strains; locally acting thermo-mechanical stresses; material parameters; mathematical model; microelectronic components; phase field theory; quantitative computer simulation; quantitative modeling; representative volume element; solder materials; surface energies; tin concentration development; Capacitive sensors; Chemical elements; Computer simulation; Joining materials; Lead; Mathematical model; Microelectronics; Thermal stresses; Thermomechanical processes; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd

Print_ISBN

0-7803-6644-1

Type

conf

DOI

10.1109/EPTC.2000.906359

Filename

906359