• DocumentCode
    2912954
  • Title

    ADI-FMM, a customized FMEA for process management in the IC assembly and test industry

  • Author

    Mena, Manolo G.

  • Author_Institution
    Philippine Assembly & Test Oper., Trias Cavite, Philippines
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    176
  • Lastpage
    180
  • Abstract
    Analog Devices, Inc. has developed the failure mechanism methodology as a customized FMEA for integrated circuit assembly and testing. This system, an integrated approach towards process management involves the generation of two dimensional matrices relating failure mechanisms to product attributes to process variables, controls, in-line and time zero monitors. The system also allows for the identification of relevant short loop and long loop reliability stresses for process qualifications. Two-dimensional matrices relating failure mechanisms to assembly design rules and test blocks also provide product and package designers with an up-front assessment of the expected performance of their designs
  • Keywords
    failure analysis; integrated circuit manufacture; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; microassembling; process monitoring; production testing; 2D matrices; ADI-FMM customized FMEA; Analog Devices Inc. failure mechanism methodology; IC assembly; IC test; assembly design rules; customized FMEA; design performance; failure mechanisms; in-line monitors; integrated circuit assembly; integrated circuit testing; integrated process management; long loop reliability stresses; package design; process controls; process management; process qualification; process variables; product attributes; product design; short loop reliability stresses; test blocks; time zero monitors; Analog integrated circuits; Assembly; Circuit testing; Control systems; Failure analysis; Integrated circuit reliability; Integrated circuit testing; Process control; Qualifications; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
  • Print_ISBN
    0-7803-6644-1
  • Type

    conf

  • DOI
    10.1109/EPTC.2000.906369
  • Filename
    906369