Title :
A comparative study of different plane modelling methodologies for high density electronic packages
Author :
Yeo, Yong Kee ; Lee, Shih Yen ; Iyer, Mahadevan K. ; Mook Seng Leong
Author_Institution :
Inst. of Microelectron., Singapore
Abstract :
There are various methods to model a power and ground plane pair found in the power distribution networks of IC packages and printed circuit boards. In this paper, three such methods are examined. The simulation results are compared with measurements and the relative merits and drawbacks of these methods are discussed
Keywords :
circuit simulation; electromagnetic field theory; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; lumped parameter networks; power supply circuits; printed circuit testing; printed circuits; transmission line matrix methods; IC packages; distributed lumped element method; electronic packages; full wave EM simulation; high density electronic packages; package measurements; plane modelling methodologies; power distribution networks; power/ground plane pair; printed circuit boards; simulation; transmission line matrix method; Circuit simulation; Distributed parameter circuits; Electronics packaging; Frequency; Integrated circuit modeling; Integrated circuit packaging; Power systems; Power transmission lines; Printed circuits; Transmission line matrix methods;
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN :
0-7803-6644-1
DOI :
10.1109/EPTC.2000.906375
