Title :
Development of solder replacement isotropic conductive adhesives
Author :
Wong, C.P. ; Lu, D.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has attracted increasing attention in the electronics industry. This new technology can offer numerous advantages over traditional soldering technology. However, some critical limitations of this technology have slowed its potentially wide application in the electronics industry. These limitations include lower electrical conductivity, increased contact resistance during elevated temperature and humidity aging, and poor impact performance. In the past few years, there have been tremendous efforts addressing these issues, and conductive adhesive technology has advanced significantly. This paper gives an overview of the main research work and achievements on conductive adhesive technology
Keywords :
adhesives; ageing; assembling; conducting polymers; contact resistance; electrical conductivity; filled polymers; humidity; impact (mechanical); printed circuit manufacture; surface mount technology; conductive adhesive technology; contact resistance; electrical conductivity; electronics industry; elevated temperature/humidity aging; impact performance; lead-bearing soldering technology; solder replacement isotropic conductive adhesives; soldering technology; Batteries; Conducting materials; Conductive adhesives; Conductivity; Environmentally friendly manufacturing techniques; Independent component analysis; Lead; Materials science and technology; Polymers; Soldering;
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN :
0-7803-6644-1
DOI :
10.1109/EPTC.2000.906376