Cracking analysis of plastic IC package in consideration of viscoelasticity

Author

Yang, Ji Hyuck ; Lee, Kang Yong

Author_Institution

Dept. of Mech. Eng., Yonsei Univ., Seoul, South Korea

fYear

2000

fDate

2000

Firstpage

251

Lastpage

257

Abstract

The purpose of this paper is to consider failure phenomena by delamination and cracking when an encapsulant for plastic IC packaging under hygrothermal loading in the IR soldering process is on viscoelastic behavior and to present the optimum design using fracture mechanics. The model for analysis is the plastic SOJ (small outline J-lead) package with a dimpled diepad. A package model with perfect delamination between chip and diepad is chosen to estimate the fracture resistance by calculating C(t)-integrals with the change of the design under hygrothermal loading. The optimum design to depress delamination and crack growth in the plastic IC package is presented

Keywords

assembling; circuit optimisation; delamination; encapsulation; failure analysis; fracture mechanics; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; plastic packaging; reflow soldering; thermal stress cracking; IR soldering process; crack growth; cracking; cracking analysis; delamination; dimpled diepad; encapsulant; failure phenomena; fracture mechanics; fracture resistance; hygrothermal loading; integrals; optimum design; package model; perfect chip-diepad delamination; plastic IC package; plastic IC packaging; plastic SOJ package; plastic small outline J-lead package; viscoelastic behavior; viscoelasticity; Delamination; Elasticity; Electromagnetic compatibility; Electronic packaging thermal management; Lead; Moisture; Plastic integrated circuit packaging; Plastic packaging; Thermal stresses; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd

Print_ISBN

0-7803-6644-1

Type

conf

DOI

10.1109/EPTC.2000.906382

Filename

906382