Title :
Electrical and thermal modelling of QFN packages
Author :
Lu, A.C.W. ; Xie, D.J. ; Shi, Z.F. ; Ryu, W.
Author_Institution :
Electron. Packaging Group, Gintic Inst. of Manuf. Technol., Singapore
Abstract :
The quad flat no lead or QFN package, a near CSP leadframe, is a promising choice for portable wireless applications such as Bluetooth TM and home RF. Attractive attributes of this advanced package include miniaturised footprint, good electrical performance and excellent thermal characteristics. The paper describes electrical and thermal modelling techniques as part of an integrated performance validation methodology for a typical 32 I/O (0.5 mm pitch) QFN package structure. It is shown how electromagnetic simulations can be used effectively to explore the design space during the QFN development cycle. Results from parametric studies on the impact of die shrink and bond wire profile are presented. A two-layer 48 I/O fine pitch (0.5 mm pitch) BGA package is also included to provide a comparison of electrical and thermal performance
Keywords :
ball grid arrays; chip scale packaging; circuit simulation; cooling; integrated circuit design; integrated circuit modelling; lead bonding; thermal analysis; thermal management (packaging); 0.5 mm; Bluetooth; QFN development cycle; QFN package structure; QFN packages; bond wire profile; design space; die shrink; electrical modelling; electrical modelling techniques; electrical performance; electromagnetic simulations; home RF applications; integrated performance validation methodology; miniaturised footprint; near-CSP leadframe; portable wireless applications; quad flat no lead package; thermal characteristics; thermal modelling; thermal modelling techniques; thermal performance; two-layer fine pitch BGA; Bonding; Chip scale packaging; Electromagnetic fields; Electronic packaging thermal management; Electronics packaging; Integrated circuit interconnections; Silicon; Space exploration; Space technology; Wire;
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN :
0-7803-6644-1
DOI :
10.1109/EPTC.2000.906399
