Elimination of lead in first level semiconductor packaging

Author

Cognetti, Carlo

Author_Institution

STMicroelectronics, Agrate, Italy

fYear

2000

fDate

2000

Firstpage

452

Lastpage

456

Abstract

Interconnection technology of the first and second levels of electronic packaging is based on tin-lead alloys, which provide cheap and reliable solder joints. International regulations for environmental protection are addressing the elimination of lead, and this poses a number of technical challenges. For first level packaging, six different technologies are involved. For four of them, Pb-free versions are available or close to being qualified; in two cases, however, solutions are not ready and require long development activity

Keywords

assembling; environmental factors; integrated circuit interconnections; integrated circuit packaging; lead; legislation; soldering; Pb; Pb elimination; Pb-free technologies; cheap solder joints; development activity; electronic packaging; environmental protection; first level packaging; first level semiconductor packaging; interconnection technology; international regulations; lead elimination; packaging technologies; reliable solder joints; technical challenges; tin-lead alloys; Coatings; Consumer electronics; Electronics packaging; Europe; Glass; Lead compounds; Plastic packaging; Semiconductor device packaging; Temperature; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd

Print_ISBN

0-7803-6644-1

Type

conf

DOI

10.1109/EPTC.2000.906415

Filename

906415