Title :
Vacuum packaging technology using localized aluminum/silicon-to-glass bonding
Author :
Cheng, Y.T. ; Hsu, W.T. ; Lin, L. ; Nguyen, C.T. ; Najafi, K.
Author_Institution :
Center for Wireless Integrated Microsyst., Michigan Univ., Ann Arbor, MI, USA
Abstract :
A vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. With 3.4 watts heating power, /spl sim/0.2 MPa applied contact pressure, and 90 minutes wait time before bonding, vacuum encapsulation at 25 mtorr can be achieved. Folded-beam comb drive /spl mu/-resonators are encapsulated and used as pressure monitors. Long-term testing of un-annealed vacuum-packaged /spl mu/-resonators with a Q of 2500 has demonstrated stable operation after 20 weeks. A /spl mu/-resonator with Q of /spl sim/9600 has been vacuum encapsulated and shown to be stable after 7 weeks.
Keywords :
Q-factor; aluminium; encapsulation; micromechanical resonators; microsensors; packaging; pressure sensors; silicon; 25 mtorr; 3.4 W; Al-Si; MEMS device; Q-factor; aluminum/silicon-to-glass bonding; folded beam comb drive microresonator; packaging technology; pressure monitor; vacuum encapsulation; Aluminum; Bonding; Encapsulation; Fabrication; Glass; Packaging; Resonance; Testing; Vacuum technology; Wafer scale integration;
Conference_Titel :
Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
Conference_Location :
Interlaken, Switzerland
Print_ISBN :
0-7803-5998-4
DOI :
10.1109/MEMSYS.2001.906468
