DocumentCode :
2914109
Title :
Dual-axes capacitive inclinometer/low-g accelerometer for automotive applications
Author :
Lapadatu, D. ; Habibi, S. ; Reppen, B. ; Salomonsen, G. ; Kvisteroy, Terje
Author_Institution :
SensoNor asa, Horten, Norway
fYear :
2001
fDate :
25-25 Jan. 2001
Firstpage :
34
Lastpage :
37
Abstract :
This paper reports a dual-axes capacitive inclinometer/low-g accelerometer based on a novel feedback operation concept. The device consists of a sensor die and an ASIC, housed in a dual-in-line transfer moulded package for surface mounting. The sensor is fabricated by bulk micromachining of silicon and triple stack anodic bonding and is primarily an accelerometer sensitive to the Earth´s gravitational field. Through the dedicated ASIC, the device can be programmed to operate either as a low-g accelerometer or as an inclinometer. The device is designed to have a programmable range up to /spl plusmn/2 g for the accelerometer and up to /spl plusmn/40/spl deg/ for the inclinometer, and a resolution of 0.61 mg and 0.1/spl deg/, respectively.
Keywords :
acceleration measurement; accelerometers; application specific integrated circuits; automotive electronics; capacitive sensors; displacement measurement; micromachining; microsensors; ASIC; automotive applications; bulk micromachining; dual-axes capacitive inclinometer; dual-in-line transfer moulded package; feedback operation; low-g accelerometer; surface mounting; triple stack anodic bonding; Accelerometers; Application specific integrated circuits; Automotive applications; Bonding; Capacitors; Feedback; Packaging; Silicon; Springs; Torque;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
Conference_Location :
Interlaken, Switzerland
ISSN :
1084-6999
Print_ISBN :
0-7803-5998-4
Type :
conf
DOI :
10.1109/MEMSYS.2001.906472
Filename :
906472
Link To Document :
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