DocumentCode :
2914321
Title :
Study on Three-Dimensional Numerical Simulation of the Influence of Fin Spacing on the Power of Heat Sink and Heat Dissipation
Author :
Jingfu Cao
Author_Institution :
Zhengzhou Univ., Zhengzhou, China
fYear :
2011
fDate :
25-28 March 2011
Firstpage :
1
Lastpage :
4
Abstract :
This paper mainly studied the heat dissipation of the heat sink placing on the level of the natural convection cooling conditions by numerical simalation.lt is found that on the conditions of the same width of the heat sink , the power of convection heat dissipation of heat sink can´t be increased by reducing spacing of fins(representing an increase of the number offins of heat sink ). By comparing the numerical simulation results of heat sink and theoretical analysis shows, there is an air stagnation zone in the heat sink of straight fins that placing on the level.The feature that there is almost no movement within the zone affected the play of natural convection of heat sink. As the narrowing of fin spacing,the area of this zone increased.There is a best numerical value of fin spacing,and there can be the maximum power of heat sink and heat dissipation under the best spacing.Over the best value, the power of heat sink and heat dissipation will be lowered because of reducing the area of fins; when under the best value, the power of heat sink and heat dissipation also will be lowered because of reducing the effective area of heat dissipation.
Keywords :
convection; cooling; heat sinks; light emitting diodes; numerical analysis; fin spacing; heat dissipation; heat sink; high-power LED; natural convection cooling; numerical simulation; semiconductor manufacturing technology; semiconductor solid light; theoretical analysis; three-imensional numerical simulation; Heat sinks; Heat transfer; Light emitting diodes; Numerical simulation; Resistance heating;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power and Energy Engineering Conference (APPEEC), 2011 Asia-Pacific
Conference_Location :
Wuhan
ISSN :
2157-4839
Print_ISBN :
978-1-4244-6253-7
Type :
conf
DOI :
10.1109/APPEEC.2011.5747704
Filename :
5747704
Link To Document :
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