High density electrical feedthrough fabricated by deep reactive ion etching of Pyrex glass

This paper reports a new fabrication technology of Pyrex glass with a fine pitch electrical feedthrough. Small through holes (40-60 /spl mu/m in diameter) in Pyrex glass plate have been fabricated using deep reactive ion etching in sulfur hexafluoride (SF/sub 6/) plasma. By filling the through holes with electroplated metal, the fine pitch electrical feedthrough in Pyrex glass plate becomes enable technology. Pyrex glass can be anodically bonded with silicon. Thus, our technology will be widely used for high density electrical feedthrough to the backside of a plate. The applications of the technology to micro probe array used for high density data storage and packaged devices are expected.