DocumentCode
2914429
Title
Fabrication of piezoelectric acoustic transducers built on cantilever-like diaphragm
Author
Cheol-Hyun Dan ; Eun Sok Kim
Author_Institution
Dept. of Electr. Eng., Hawaii Univ., Honolulu, HI, USA
fYear
2001
fDate
25-25 Jan. 2001
Firstpage
110
Lastpage
113
Abstract
The paper presents a technique to fabricate a cantilever-like diaphragm that releases the residual stress (and also is mechanically flexible) much like a cantilever, and yet is itself a diaphragm with its four edges clamped. Using the high mechanical flexibility (i.e., extremely low Young´s Modulus) of parylene as a holding layer, we have successfully fabricated various piezoelectric acoustic transducers built on silicon nitride layer (either in cantilever form and/or freely-suspended island form) with electrodes and piezoelectric ZnO film. Since parylene has relatively low melting point (around 280/spl deg/C for parylene C), we deposit the parylene holding layer toward the end of the fabrication process after processing all the high temperature steps. Then after releasing the diaphragm with KOH etching, the silicon nitride is patterned from the backside with a reactive ion etcher (RIE). To demonstrate the effectiveness of a parylene-held cantilever-like diaphragm in releasing the residual stress, the devices before and after patterning the silicon nitride are compared. The acoustic outputs of the fabricated transducers have been measured with B&K 4135 microphone.
Keywords
acoustic transducers; diaphragms; internal stresses; micromechanical devices; piezoelectric transducers; zinc compounds; KOH etching; MEMS device; SiN; Young modulus; ZnO; ZnO film; cantilever-like diaphragm; fabrication; mechanical flexibility; parylene holding layer; piezoelectric acoustic transducer; reactive ion etching; residual stress; silicon nitride layer; Acoustic transducers; Electrodes; Etching; Fabrication; Piezoelectric films; Residual stresses; Semiconductor films; Silicon; Temperature; Zinc oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
Conference_Location
Interlaken, Switzerland
ISSN
1084-6999
Print_ISBN
0-7803-5998-4
Type
conf
DOI
10.1109/MEMSYS.2001.906491
Filename
906491
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