DocumentCode
2914574
Title
Enhancement of breakdown strength by microdischarge under impulse voltage applications in vacuum
Author
Aoki, Keita ; Nishimura, Ryouki ; Kojima, Hiroki ; Homma, Mitsutaka ; Shioiri, Tetsu ; Okubo, Hitoshi
Author_Institution
Nagoya Univ., Nagoya, Japan
fYear
2010
fDate
Aug. 30 2010-Sept. 3 2010
Firstpage
32
Lastpage
35
Abstract
An investigation of charge behavior such as microdischarge under high electric field in vacuum is very important in order to enhance the electrical insulation performance of vacuum circuit breakers and vacuum interrupters (VCB/VI). This paper discusses the enhancement characteristics of breakdown strength by microdischarge under applying impulse voltage repeatedly and changing vacuum pressure. As a result, microdischarge which had pulsed current waveform became smaller with repeated constant peak voltage applications under 10-6 Pa vacuum. In addition, microdischarge generation had the electrode conditioning effect to raise the breakdown voltage by reducing adsorption gas of the electrodes. Microdischarge having very small charge compared with that of breakdown has a possibility of drastic enhancement of breakdown strength in vacuum, as the non-breakdown conditioning technique.
Keywords
discharges (electric); vacuum breakdown; vacuum circuit breakers; vacuum interrupters; VCB-VI; adsorption gas reduction; breakdown strength enhancement; electrical insulation performance; electrode conditioning effect; high electric field; impulse voltage; microdischarge generation; nonbreakdown conditioning technique; pulsed current waveform; repeated constant peak voltage; vacuum circuit breakers; vacuum insulation; vacuum interrupters; vacuum pressure; Breakdown voltage; Discharges; Electrodes; Sparks; Vacuum breakdown; Voltage measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2010 24th International Symposium on
Conference_Location
Braunschweig
ISSN
1093-2941
Print_ISBN
978-1-4244-8367-9
Electronic_ISBN
1093-2941
Type
conf
DOI
10.1109/DEIV.2010.5625863
Filename
5625863
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