Convection-based micromachined inclinometer using SOI technology

Author

Billat, S. ; Glosch, H. ; Kunze, M. ; Hedrich, F. ; Frech, J. ; Auber, J. ; Lang, W. ; Sandmaier, H. ; Wimmer, W.

Author_Institution

Inst. for Micromachining & Inf. Technol., Hahn-Schickard-Gesellscaft, Villingen-Schwenningen, Germany

fYear

2001

fDate

25-25 Jan. 2001

Firstpage

159

Lastpage

161

Abstract

This paper presents a novel inclinometer operating with the free-convection heat transfer principle which has been developed at the HSG-IMIT for the VOGT electronic company. The use of SOI-technology permits a short technological process for the sensor fabrication and a very good mechanical stability like a high reproducibility. Using free convection properties the sensor presents a high resolution (0.007/spl deg/), a great sensitivity and baseline stability.

Keywords

angular measurement; mechanical stability; micromachining; microsensors; natural convection; silicon-on-insulator; SOI technology; Si; free convection; heat transfer; inclinometer; mechanical stability; micromachining; reproducibility; resolution; sensitivity; sensor fabrication; Bridge circuits; Domestic safety; Fabrication; Heat transfer; Mechanical sensors; Resistance heating; Silicon; Stability; Temperature sensors; Thermal sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on

Conference_Location

Interlaken, Switzerland

ISSN

1084-6999

Print_ISBN

0-7803-5998-4

Type

conf

DOI

10.1109/MEMSYS.2001.906504

Filename

906504