DocumentCode
2914798
Title
Cathode potential drop at a transient cathode spot on a microprotrusion
Author
Beilis, I.I.
Author_Institution
Electr. Discharge & Plasma Lab., Tel Aviv Univ., Tel Aviv, Israel
fYear
2010
fDate
Aug. 30 2010-Sept. 3 2010
Firstpage
375
Lastpage
378
Abstract
Phenomena in the space charge layer at the cathode surface were considered to determine the cathode potential drop (CPD), taking into account the electron momentum and energy. The approach was based on the heavy particle kinetics in the Knudsen layer developed previously for a bulk cathode with a smooth surface. The modified kinetic model was considered in order to obtain the CPD dependence on time for a transient spot on a cathode protrusion, taking into account heat transfer. The erosion of the protrusion, and hence its size decrease, during cyclic plasma action with life time τ was included in the model. The calculation showed that the CPD decreased with time t, e.g. for a 5 μm Cu protrusion from about 90 to 13 V, when t increased from 50 ns to 1 μs. During this period the spot temperature decreased from 4500 to 3600 K and the calculated spot current was about 3-5 A (which agrees with that observed for spot fragments). These results facilitate understanding the relatively large voltage needed for arc ignition compared to the low voltage appearing during steady arc operation.
Keywords
cathodes; space charge; transient analysis; vacuum arcs; CPD dependence; Knudsen layer; arc ignition; bulk cathode; cathode potential drop; cathode protrusion; cathode surface; cyclic plasma; microprotrusion; modified kinetic model; space charge layer; temperature 4500 K to 3600 K; time 50 ns to 1 mus; transient cathode spot; vacuum arc; Cathodes; Heating; Kinetic theory; Mathematical model; Plasma temperature; Vacuum arcs;
fLanguage
English
Publisher
ieee
Conference_Titel
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2010 24th International Symposium on
Conference_Location
Braunschweig
ISSN
1093-2941
Print_ISBN
978-1-4244-8367-9
Electronic_ISBN
1093-2941
Type
conf
DOI
10.1109/DEIV.2010.5625876
Filename
5625876
Link To Document