DocumentCode
2915515
Title
Modeling of capillary forces and binding sites for fluidic self-assembly
Author
Bohringer, K.F. ; Srinivasan, U. ; Howe, R.T.
Author_Institution
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
fYear
2001
fDate
25-25 Jan. 2001
Firstpage
369
Lastpage
374
Abstract
Massively parallel self-assembly is emerging as an efficient, low-cost alternative to conventional pick-and-place assembly of microfabricated components. The fluidic self-assembly technique we have developed exploits hydrophobic-hydrophilic surface patterning and capillary forces of an adhesive liquid between binding sites to drive the assembly process. To achieve high alignment yield, the desired assembly configuration must be a (global) energy minimum, while other (local) energy minima corresponding to undesired configurations should be avoided. Thus, the design of an effective fluidic self-assembly system using this technique requires an understanding of the interfacial phenomena involved in capillary forces; improvement of its performance involves the global optimization of design parameters such as binding site shapes and surface chemistry. This paper presents a model and computational tools for the efficient analysis and simulation of fluidic self-assembly. The strong, close range attractive forces that govern our fluidic self-assembly technique are approximated by a purely geometric model, which allows the application of efficient algorithms to predict system behavior. Various binding site designs are analyzed, and the results are compared with experimental observations. For a given binding site design, the model predicts the outcome of the self assembly process by determining minimum energy configurations and detecting unwanted local minima, thus estimating expected yield. These results can be employed toward the design of more efficient self-assembly systems.
Keywords
capillarity; microassembling; microfluidics; micromechanical devices; semiconductor process modelling; MEMS; adhesive liquid; alignment yield; binding sites; capillary forces; design parameters; expected yield; fluidic self-assembly; geometric model; global optimization; hydrophobic-hydrophilic surface patterning; interfacial phenomena; massively parallel self-assembly; minimum energy configurations; surface chemistry; Analytical models; Assembly; Chemistry; Computational modeling; Design optimization; Prediction algorithms; Predictive models; Self-assembly; Shape; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
Conference_Location
Interlaken, Switzerland
ISSN
1084-6999
Print_ISBN
0-7803-5998-4
Type
conf
DOI
10.1109/MEMSYS.2001.906555
Filename
906555
Link To Document