• DocumentCode
    2915679
  • Title

    A thermal bubble actuated micro nozzle-diffuser pump

  • Author

    Tsai, J.-H. ; Lin, L.

  • Author_Institution
    Dept. of Mech. Eng. & Appl. Mech., Michigan Univ., Ann Arbor, MI, USA
  • fYear
    2001
  • fDate
    25-25 Jan. 2001
  • Firstpage
    409
  • Lastpage
    412
  • Abstract
    A valve-less micropump using the principles of thermal bubble actuation and nozzle-diffuser flow regulation is successfully demonstrated. The pump consists of a meander-shaped resistive heater, a pair of nozzle-diffuser flow controllers, and a 1 mm in diameter, 50 /spl mu/m in depth pumping chamber. Liquid is actuated by periodically expanding and collapsing thermal bubbles via resistive heating and a net flow is induced by the nozzle-diffuser flow regulator. Both single-bubble and dual-bubble actuation modes have been investigated. In the single-bubble pumping mode, a maximum flow rate of 5 /spl mu/l/min is measured at the driving pulse of 10% duty cycle at 250 Hz under an average power consumption of 1 W. A similar flow rate of 4.5 /spl mu/l/min is measured in the dual-bubble pumping mode, at the driving pulse of 5% duty cycle at 400 Hz with 0.5 W of average power consumption. The highest measured pumping pressure is 377 Pascal at zero volume flow rate.
  • Keywords
    bubbles; microactuators; micropumps; nozzles; resistance heating; 0.5 W; 1 W; 1 mm; 250 Hz; 377 Pa; 400 Hz; 50 micron; actuation modes; average power consumption; driving pulse; dual-bubble pumping mode; meander-shaped resistive heater; micro nozzle-diffuser pump; pumping chamber; pumping pressure; resistive heating; single-bubble pumping mode; thermal bubble actuated pump; valve-less micropump; zero volume flow rate; Energy consumption; Fluid flow measurement; Heat pumps; Heating; Micropumps; Power measurement; Pulse measurements; Temperature control; Thermal expansion; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
  • Conference_Location
    Interlaken, Switzerland
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5998-4
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2001.906563
  • Filename
    906563